Polar Speedstack 2026: PCB Stackup Design & Documentation Software

Speedstack 2026 is Polar Instruments’ professional software for designing, documenting, and communicating PCB multilayer stackups. It integrates impedance and insertion loss field solvers (Si8000m/Si9000e) with stackup design, providing material libraries, controlled impedance modeling, and customizable reports for design-to-manufacturing workflows .

Key New Features in 2026

Ventec Glass-Free Materials Integration

The mid-year release adds Ventec pro-bond and thermal-bond materials to online resources, including non-reinforced Bondply dielectrics (RCC/RCF) that eliminate glass-weave micro-Dk variability for high-speed, fine-feature designs .

Enhanced Material Identification & Visualization

New visual extensions allow users to identify material types at a glance with customizable display colors in stackup documentation, simplifying communication of complex stack requirements .

Scriptable Extensions (May 2026)

Optional scripting capability enables custom Speedstack extensions, such as exporting XML for additional design rule checks or post-processing and re-ingesting XML files .

IPC-2581 Rev C Support (March 2026)

Supports import/export of IPC-2581 Rev C with multiple structures per layer for improved data exchange between design and fabrication .

Compatibility Updates

Minor updates for compatibility with CITS systems in regions using a comma as decimal separator (Speedstack/CGen 2026) .

Product:Ploar Speedstack 2026
Version:2026.03.01
Supported Architectures: x64
Language: English
Supported Operating Systems:Windows10even or newer
Size: 1CD