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Allows large designs to be opened rapidly
Supports automatic chip finishing operations through a TCL programming API
Allow users to cut, copy, paste, delete, move and more with unlimited undo/redo function; and access native data within the GDSII database, including polygons, edges, text, cells, instances, arrays and more.
Fast, streamlined iteration loop through integration with Calibre Interactive and RVE
Quick GDSII loading, viewing, error identification, modification and re-invocation
Benefits:
Dramatically reduces time to tape-out
Allows convenient re-verification of the full design, or only the data that has been modified
Efficiently automates chip finishing tasks
Calibre RVE
Allows cross probing of results between layout, schematic, source netlist, layout netlist and LVS result files
Enables viewing of all parasitics in the Parasitic Browsing window
Highlights to schematic capture tools
Automated short isolation debugging
Fast and intuitive hierarchical SPICE browser for source and layout netlists
Benefits
Seamless integration with popular design environments preserves the investment in EDA tools
Quick, intuitive debugging in cell/block and full-chip designs
Calibre YieldAnalyzer
Determines location of the most significant yield improvement opportunities and provides graded yield metrics by issue, cell, window, etc.
Assesses the weighted “grayscale” of features that fail to meet recommended rules.
Assesses the weighted sensitivity to random particles using critical area analysis.
Runs analysis directly on GDSII, OASIS, MilkyWay, and OpenAccess design databases.
Benefits:
Provides manufacturing teams a method of communicating yield and yield modeling information to the design teams.
Executes and visualizes analysis from within all the popular layout environments, including Mentor Graphics IC Station and Calibre DESIGNrev, Cadence® Virtuoso/Encounter, Synopsys® Astro and Magma BlastFusion.
Helps designers see through the fog of DFM rule violations, enabling the ability to make decisions and trade-offs about yield impact issues.