Ansys RedHawk-SC Electrothermal features multiphysics power integrity, signal integrity, thermal integrity, and mechanical stress simulation and analysis for 2.5D/3D multi-die systems.
MULTIPHYSICS SIGNOFF FOR 3DIC
Electrical, Thermal and Mechanical Signoff Solution for 2.5D/3DIC system
The Ansys RedHawk-SC Electrothermal is a Multiphysics simulation platform. It delivers a complete solution for analyzing multi-die chip packages and interconnects for power integrity, layout parasitic extraction, thermal profiling, thermo-mechanical stress, and signal integrity. Integrated within the cloud-native SeaScape platform enables high-capacity electrothermal analysis for early-design exploration, post-layout design verification, and silicon signoff of stacked-die system. It is foundry certified for integrated fanout and silicon interposer technologies.
Modern multi-die packages with 2.5D interposers or 3D stacking technology assemble complex integrated systems that are tightly coupled across a range of physics, including power integrity, signal integrity, thermal and mechanical stress/warpage. The only way to accurately predict the overall behavior of these systems is with a unified analysis environment that brings together market-leading engines from multiple tools into a simultaneous multiphysics solution.
RedHawk-SC Electrothermal lowers design time and design risk with integrated access to Ansys analysis algorithms, from industry-leading chip, board and system-level tools across multiple disciplines. Its range is unmatched by any other product.
This has led major foundries to certify RedHawk-SC Electrothermal as a signoff solution for their multi-die packaging technologies.
Its high capacity and silicon-correlated accuracy not only reduces risk but also allows reduced safety margins, which leads to significant reductions in power and higher performing designs.
Product:ANSYS Apache RedHawk 2022 R1
Version:2022
Supported Architectures: x64
Language: english
Supported Operating Systems:Linux 64
Size: 1DVD