Dynaform-v5.7.1- ETA

DYNAFORM 5.7.1 is the complete die system simulation solution. DYNAFORM allows the organization to entirely bypass soft tooling, reducing overall tryout time, lowering costs, increasing productivity and providing complete confidence in die system design. It also allows evaluation of alternative and unconventional designs and materials for an optimal solution. The most cost-effective and accurate solution available, DYNAFORM is the clear choice among progressive organizations seeking to streamline the die analysis system.

One Simple Interface
ImageDYNAFORM encompasses the entire die system process in one simple interface. By simulating every detail during the design stage, DYNAFORM ensures the highest quality formed part and best manufacturing process. The system guides the engineer through cost estimation, quoting, die face design and formability analysis. Then, in a virtual environment, moves the part through the stamping process inside the plant—station by station. DYNAFORM 5.7.1 simulates trimming/shedding and scrap removal and analyzes die structural integrity. Finally, DYNAFORM evaluates the part transfer process within the die system and simulates the behavior of the part during shipping.
A Solid Infrastructure
DYNAFORM offers NURBS based CAD surfaces capability. This allows DYNAFORM’s mesh-based technology to maintain full parametric associativity throughout the entire simulation process. LS-DYNA , the most powerful solver in its class, is the engine within DYNAFORM 5.7.1. Offering tremendous calculation power to support difficult modeling and simulation challenges within a die system, these powerful processing and solving technologies enable DYNAFORM to meet the needs of users today and those in the future.
The Most Accurate & Cost-Effective Solution
The clear price/performance leader in the industry, DYNAFORM offers pin-point accuracy in every detail and is the key reason die designers all over the world have turned to DYNAFORM for the most precise analysis possible.

The powerful dual-solver is the engine that powers the efficient processing environment of DYNAFORM, making it a complete simulation solution package. LS-DYNA uniquely offers both explicit & implicit solutions that can be seamlessly switched to correctly simulate the physics of virtually all engineering concerns of a die system including formability, springback, springback compensation, trimming, and flanging.
LS-DYNA™ is a trademark of Livermore Software Technology Corporation.

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